Embedded Electrical Engineer - SoM at Signal Processing Engineer (RF Processing & Analytics)
- Company: Signal Processing Engineer (RF Processing & Analytics)
- Location: Paris
- Employment type: Full Time
- Posted: 2026-09-27
About Us
Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces.
Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected.
About the role
As an Embedded Electrical Engineer at Harmattan AI, you will join the R&D team to design the compute modules and associated boards used across our platforms. You will own these designs end-to-end, from system architecture and schematic through layout guidance, fabrication, bring-up, and qualification. This is a high-impact role that combines demanding high-speed design work with hands-on bench work, taking hardware from a first prototype through to boards that fly.
Responsibilities
Board Design: Design SoMs, baseboards, and test boards for our compute platforms.
High-Speed Digital Design: Design around high-end application processors, covering PCIe, 10 Gb Ethernet, USB 3.x, and MIPI, managing layout constraints and signal integrity.
Power Design: Design power trees, sequencing, and conversion topologies, and verify power-up and power-down behaviour.
Design Reviews: Prepare and lead design reviews at each milestone, from block diagram to release for fabrication.
Manufacture: Work with PCB and EMS partners on stack-up, via technology, layout guidance, and cost trade-offs.
Bring Up and Qualification: Define verification test plans, troubleshoot and characterise boards, and run thermal, vibration, EMC, and ESD qualification.
Cross-Functional Collaboration: Work with the embedded software team through board bring-up, the mechanical team on form factor and thermal constraints, and validation for flight qualification.
Candidate requirements
Educational Background: MSc in electrical, computer, or a related engineering field. A PhD is a plus. A hands-on design and bring-up record matters more than the specific degree.
Experience: 5 years minimum in embedded hardware design, with boards taken from specification through bring-up and qualification into production.
Technical Expertise: High-speed design including layout constraints, signal integrity, and validation. Systems built around a processor with external memory (DDR, Flash) are carried through to a committed layout. Power trees with deliberate conversion topologies and verified power-up and power-down behaviour.
Tools: In-depth knowledge of electronic CAD tools (e.g., Altium).
Testing Proficiency: Proficiency with electronic test equipment and experience planning thermal, vibration, EMC, and ESD qualification.
Manufacturing: Experience working with fabrication and assembly partners on stack-up, via technology, and cost trade-offs.
Problem Solving: Rigorous, structured, and analytical; able to work autonomously and see a board from concept through to production.
Communication and Influence: Excellent written and verbal communication, able to present design and test results to engineers and senior stakeholders.
Additional Skills: FPGA or MPSoC design, prior work deploying AI inference on embedded targets, and UAS, drone, or defence hardware experience are strong advantages.
Commitment: 100% dedication to Harmattan AI's mission, vision, and ambitious growth plans, ready to go the extra mile to ensure operational excellence. Thrives in a fast-paced environment where priorities shift and no task is too small.
We look forward to hearing how you can help shape the future of autonomous defense systems at Harmattan AI.
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